Liste der Veröffentlichungen und Vorträge | |
2021 | |
Alexander Kaiser, Jürg Moser: | |
Advanced thin film technology - Solutions for aerospace, sensors, telecommunication and high frequency applications. | |
Online Webinar, March 24, 2021. | |
Alexander Kaiser: | |
Do’s and Don’ts bei Dünnfilmschaltungen: Worauf sollte man achten, was sollte man vermeiden oder: “Jenseits der Design Rules”. | |
Fachgruppentreffen „Intelligente Implantate“ des microTec Südwest, 27. April 2021, Online Veranstaltung. | |
A. Kaiser, P. Matej, K. Hanka, M. Abel, C. Herbort, R. Lang, O. Pursche, K. Ruess, and U. Keim: | |
Thin film flexible circuits with embedded ASICs– Enabling technology for sophisticated medical applications. | |
Proceedings IMAPS 2021. The 54th International Symposium on Microelectronics, San Diego, California, USA, October 11-14, 2021. | |
Dr.-Ing. Alexander Kaiser; Paul Matej, Dr. Christian Herbort; Robert Lang. Oliver Pursche, Karin Ruess, and Uwe Keim, Kevin Hanka, Martin Abel, Ulrike Passlack; Dr. Christine Harendt, Benjamin Burg; Dr. Thorsten Göttsche, Maolei Zhou, Prof. Dr. Andreas Dietzel: | |
Chipintegration in Dünnfilm-Sensorflex – Technologische Entwicklungen im Projekt „FLEXMAX“. | |
Proceedings VDE MikroSystemTechnik Kongress 2021. 08.-10. November 2021, Ludwigsburg, Deutschland. | |
Maolei Zhou, Chresten von der Heide, Ulrike Passlack, Kevin Hanka, Christine Harendt, Alexander Kaiser, Andreas Dietzel: | |
Vier-Level-Mikro-Via-Technologie (4LƒÊV) fur die ASIC-Integration in aktive flexible Sensorfolien. | |
Proceedings VDE MikroSystemTechnik Kongress 2021. 08.-10. November 2021, Ludwigsburg, Deutschland. | |
Alexander Kaiser: | |
Embedded ASICs in Thin Film Flexible Circuits – Solution for added functionality. | |
ZVEI- PCB & EMS Speakers Corner zur productronica 2021. München, 16.-19. November 2021. | |
2020 | |
Alexander Kaiser, Jürg Moser: | |
Thin-film solutions for medical and life science applications. | |
Online Webinar, November 24, 2020. | |
2019 | |
Alexander Kaiser: | |
Grundlagen und Anwendungen der Dünnfilmtechnik. | |
In: Handbuch der Leiterplattentechnik Band 5, Leuze Verlag 2019. | |
Alexander Kaiser: | |
Dünnfilmanwendungen für Medizin und Lebenswissenschaften. | |
ZVEI-Podium auf der SMT Connect 2019, Nürnberg, 08. Mai 2019. | |
Alexander Kaiser, Paul Matej, Christian Herbort, Reto Ventruto, Karin Ruess, Uwe Keim: | |
Manufacturing Technologies for Electrical Treatment, Probing and Analysis Applications in Medicine and Life Science. | |
41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society EMBC, Berlin, Germany, July 23rd - July 27th, 2019. | |
Alexander Kaiser: | |
Dünnfilmschaltungen für Medizin und Lebenswissenschaften. | |
EFDS Gemeinsame Sitzung des FABM und FAFK. FHR Anlagenbau GmbH, Ottendorf-Okrilla, 17. September 2019. | |
Alexander Kaiser, Paul Matej, Christian Herbort, Karin Ruess, Reto Ventruto, Martin Abel, Uwe Keim: | |
Thin Film Circuits for Medicine and Life Science Applications. | |
EFDS-Kongress V2019 Workshop Bio & Medizin WS2 - V10. Intern. Congress Center Dresden, Dresden, 08. – 10. Oktober 2019. | |
2018 | |
A. Kaiser, G. Bauböck, K.-H. Fritz: | |
Dünnfilmtechnologie für Sensorik und Analyse in Medizin- und Life Science - Anwendungen. | |
microTEC Südwest Clusterkonferenz 2018. Freiburg, Deutschland, 16. - 17. April 2018. | |
Frank-Ralf Meyer, Alexander Kaiser: | |
The significance of innovations and their practical implementation for micro sensors. | |
VDMA Exhibitor Forum: Product Innovation - Smart Health Forum - Medtec Insights 1 - Hall 9 - 9D46. Medtec Europe 2018. Stuttgart, April 19, 2018. | |
Alexander Kaiser: | |
Aktuelle Technologien und Packaging-Lösungen mit Dünnfilmsubstraten. | |
ZVEI-Podium auf der SMT Hybrid Packaging 2018, Nürnberg, 05. Juni 2018. | |
Alexander Kaiser, Sebastian Löffler, Karl-Heinz Fritz, Günther Bauböck: | |
Miniaturization of Medical Implants and Devices - Fabrication Solutions based on Thin Film Technology and Micro Assembly. | |
Fokus-Session Intelligente Implantate auf der Jahrestagung BMT, BMT 2018 52nd DGBMT Annual Conference, September 26 - 28, 2018, Aachen, Deutschland. | |
Alexander Kaiser: | |
Dünnfilmtechnik für Packaging, Schaltungen und Sensorik. Thin Film Technology for Packaging, Circuits and Sensors. | |
ZVEI-Podium auf der electronica 2018: Erfolgslösungen mit Keramik - Basistechnik für elektronische Mikrosysteme. Messe electronica 2018, München, 14. November 2018. | |
2017 | |
Alexander Kaiser: | |
Miniaturized Medical Devices using Advanced Substrate Technologies. | |
Medtec Europe 2017. Stuttgart, April 05, 2017. | |
Alexander Kaiser: | |
Thin-Film substrates: Introduction and technical details. | |
Cicor Customer Seminar. Ankara, Turkey. April 26, 2017. | |
Alexander Kaiser: | |
Flexible Schaltungsträger in Dünnfilmtechnik - Technologien und Anwendungen. | |
PRONTO Workshop, Stuttgart. Juli 2017. | |
Alexander Kaiser: | |
Interview Miniatursensorik: flexible Kontrolle des Augeninnendrucks bei Grünem Star. | |
Online-Artikel. https://www.compamed.de/~. Compamed Magazin, August 2017. | |
Alexander Kaiser, Eyad Assaf, Karl-Heinz Fritz, Günther Bauböck: | |
Thin Film Technology based Sensors and Analysis Tools for Medical and Life Science Applications. | |
5th Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications. November 22 -23, 2017, Lyon, France. | |
Alexander Kaiser, Uwe Schindler: | |
Lösungen für Miniaturisierung in der Medizintechnik. | |
INNO IVAM Fachmagazin, 22. Jahrgang, Nr. 68, November 2017, S. 3. | |
2016 | |
A. Kaiser, C.M. Bee, F. Dupuis, K. Rueß, P. Matej, C. Herbort, B. Holl, S. Löffler, G. Bauböck, K.-H. Fritz: | |
Flexible LCP-basierte Mehrlagen-schaltungen in Dünnschichttechnik: Technologie und Eigenschaften. | |
microTEC Südwest Clusterkonferenz 2016. Freiburg, 14. - 15. März 2016. | |
Ursula Gore, Alexander Kaiser, and Karl-Heinz Fritz: | |
Combining Thin-Layer and PCB Technology in Microelectronics. | |
US Tech Journal, March Edition 2016, pp. 62 and 69. | |
A. Kaiser, F.-R. Mayer: | |
Zero Waste Innovation - The Way to Innovation. | |
Medtec Europe 2016. Stuttgart, April 12 - 14, 2016. | |
C.M. Bee, A. Kaiser, F. Dupuis, R. v. Metzen, K. Rueß, P. Matej, C. Herbort, B. Holl, K.-H. Fritz, G. Bauböck: | |
Multi-layer circuits with LCP and noble metals: Technology and characterization. | |
[MEET THE EXPERT] Implants 2016, Interlaken, Switzerland, April 25 -26, 2016. | |
Sebastian Löeffler, Günter Reppe, Angela Rebs, Marcus Herrmann, Christopher Mauermann, Alexander Kaiser, and Karl-Heinz Fritz: | |
Advances in Thick-Film Ceramic Technology. | |
US Tech Journal, August Edition 2016, pp. 48 - 49. | |
Alexander Kaiser, Karl-Heinz Fritz: | |
Dünnschichttechnik. | |
In ZVEI-Broschüre Erfolgslösungen mit Keramik, ZVEI Fachverband PCB and Electronic Systems. Oktober 2016. | |
Christian Herbort, Alexander Kaiser, Karin Rueß, Paul Matej, Maximilian Bee, G. Bauböck: | |
Femtosecond Laser in Micro Production. Thin Film Micro Manufacturing at its best: State-of-the-Art Laser Machining utilizing ultra-short-pulse. | |
Cicor White Paper, December 2016. | |
2015 | |
A. Kaiser: | |
Durch Innovation zur maßgeschneiderten Therapie: Ein implantierbarer Augeninnendruck-Sensor. | |
Online Artikel MicroTec Südwest. http://microtec-suedwest.de/forschung-projekte/erfolgsgeschichten/durch-innovation-zur-massgeschneiderten-therapie/. Februar 2015. | |
A. Kaiser: | |
Flexible Medizinelektronik. Produktinnovationen durch Technologieentwicklungen. | |
Zeitschrift Bayern Innovativ "Vernetzt", Ausgabe 2, 2015, S. 16. | |
A. Kaiser: | |
Flexible Medizinelektronik: Ein Sensor erfasst den Augeninnendruck. | |
Online-Artikel. http://www.elektronikpraxis.vogel.de/medizintechnik/articles/483608/. Elektronikpraxis März 2015. | |
A. Kaiser: | |
Lösungen für anspruchsvolle Medizintechnikprodukte: Dünnschichtschaltungen für Sensorik und Analytik. | |
Bayern innovativ Kooperationsforum Medizinelektronik, München, 29.April 2015. | |
C.M. Bee, A. Kaiser, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck, K.-H. Fritz: | |
Thin Film flexible circuits: Chances for overall cost reduction in medical applications. | |
[MEET THE EXPERT] Implants 2015, Interlaken, Switzerland, May 7 -8, 2015. | |
A. Kaiser, C.M. Bee, Frederic Dupuis, R. v.Metzen, K. Rueß, P. Matej, C. Herbort, B. Holl, S. Löffler, G. Bauböck and K.-H. Fritz: | |
Thin Film Based LCP Multi-Layer Circuits: Manufacturing Technology and Characterization. | |
EMPC 2015, September 14 - 16, Friedrichshafen, Germany. | |
S. Löffler, G. Reppe, A. Rebs, M. Herrmann, C. Mauermann, A. Kaiser, K.-H. Fritz: | |
Thickfilm ceramic ready for MCM Interposer. | |
EMPC 2015, September 14 - 16, Friedrichshafen, Germany. | |
A. Kaiser, C.M. Bee, Frederic Dupuis, R. v.Metzen, K. Rueß, P. Matej, C. Herbort, B. Holl, S. Löffler, G. Bauböck und K.-H. Fritz: | |
Flexible LCP-basierte Mehrlagenschaltungen in Dünnschichttechnik: Herstellungstechnologie und Charakteristika. | |
VDE MikroSystemTechnik Kongress 2015. 26.-28. Oktober 2015, Aachen, Deutschland. | |
R. Ventruto, P. Schumacher, H. Good , A. Kaiser, G. Bauböck und K.-H. Fritz: | |
Mikrofluidikmodule für die Biotechnologie: Herstellung und Charakteristika. | |
VDE MikroSystemTechnik Kongress 2015. 26.-28. Oktober 2015, Aachen, Deutschland. | |
C.M. Bee, A. Kaiser, Frederic Dupuis, R. v.Metzen, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck und K.-H. Fritz: | |
Advanced Flexible Thin Film Circuits: LCP Multi-Layer Technology with noble metals. | |
Forum Be-Flexible 2015, Thin Semiconductor Devices and Flexible Electronic Systems for the Internet of Things, November 17 - 18, 2015, Munich, Germany. | |
C.M. Bee, A. Kaiser, Frederic Dupuis, R. v.Metzen, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck und K.-H. Fritz: | |
Advanced Flexible Thin Film Circuits: LCP Multi-Layer Technology with noble metals. | |
Forum Be-Flexible 2015, Thin Semiconductor Devices and Flexible Electronic Systems for the Internet of Things, November 17 - 18, 2015, Munich, Germany. | |
2014 | |
A. Kaiser, S. Löffler, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck: | |
Flexible Mehrlagen-Schaltungen in Dünnschichttechnik: Technologie-Plattform für Intelligente Implantate. | |
MicroTEC Südwest Clusterkonferenz 2014: Innovationsbeschleunigung für neue Märkte. 05.-06. Mai 2014, Freiburg, Deutschland. | |
A. Kaiser, K. Rueß, P. Matej, C. Herbort, B. Holl, C.M. Bee, S. Löffler, K.-H. Fritz, G. Bauböck: | |
Flexible LCP-Mehrlagenschaltungen in Dünnfilmtechnik: Technologie und Anwendung. | |
Deutsche IMAPS Konferenz, 23. und 24. Oktober 2014, München, Deutschland. | |
A. Kaiser: | |
Thin Film Circuits for Medicine and Life Science: Technology and Application. | |
CICOR Customer Workshop 2014. From Substrates to Complete Systems: Innovations for Medical & Life Science, November 11, 2014, Ulm, Germany. | |
Dr. Alexander Kaiser: | |
Thin Film Based Technologies and Systems for Medical Applications. | |
Compamed HighTech Forum by IVAM 2014, November 11-14, 2014, Düsseldorf, Germany. | |
A. Kaiser, K. Rueß, P. Matej, C. Herbort, B. Holl, C.M. Bee, S. Löffler, K.-H. Fritz, G. Bauböck: | |
Flexible Thin Film Circuits using LCP Multi-Layer Technology. | |
2nd Advanced Technology Workshop on Microelectronics, Systems and Packaging for Medical Applications, December 10 -11, 2014, Lyon, France. | |
2013 | |
Alexander Kaiser: | |
Flexible Dünnfilmschaltungen für medizinische Anwendungen. | |
7. COMPAMED Frühjahrsforum. MST-Evolution: raffinierte Hightech-Konstruktionen für den menschlichen Körper. Stuttgart, 25. April 2013. | |
Alexander Kaiser, Günther Bauböck: | |
Flexible Schaltungsträger für die Medizintechnik. | |
Workshop: Flexible und kompakte Elektronik für Medizintechnik und Biosensorik. Reutlingen, 06. Juni 2013. | |
A. Kaiser, K. Rueß, P. Matej, C. Herbort, B. Holl, G. Bauböck: | |
Thin Film Flexible Circuits: Technology, Characteristics and Applications. | |
EMPC 2013. September 9 - 12, 2013. Grenoble, France. | |
Dr. Alexander Kaiser, Karin Rueß, Paul Matej, Dr. Christian Herbort, Dr. Bruno Holl, Dr. Günther Bauböck: | |
Flexible Mehrlagen-Schaltungen in Dünnschichttechnik: Technologien und Charakteristika. | |
VDE MikroSystemTechnik Kongress 2013. 14.-16. Oktober 2013, Aachen, Deutschland. | |
Dr. Alexander Kaiser: | |
Thin Film Flexible Circuits for Medical Applications. | |
Compamed Suppliers Forum 2013, November 20-22, 2013, Düsseldorf, Germany. | |
2011 | |
Evangelos A. Angelopoulos, Alexander Kaiser: | |
Epitaxial Growth and Selective Etching Techniques . | |
In: Ultra-thin Chip Technology and Applications, Springer 2011. | |
Alexander Kaiser, Frank Kranhold: | |
TR Module in Advanced Thin Film Technology for Radar Applications. | |
RADCOM 2011: Radar, Communication & Measurement, Hamburg, 6.-7. April 2011. | |
Alexander Kaiser, Frank Kranhold: | |
Packaging-Lösungen für Mikrowellenkomponenten - auf Basis von ausgewählten Keramiksubstraten. | |
EEEfCOM 2011: Electrical and Electronic Engineering for Communication, Ulm, 25.-26. Mai 2011. | |
2010 | |
Alexander Kaiser: | |
Thin Film Substrates for Medical Applications. | |
iNEMI Workshop: "Challenges Facing Medical Electronics Packaging and Substrates", Berlin, Germany, September 16-17, 2010. | |
2009 | |
A. Kaiser, K. Ruess, B. Holl, E. Feurer, A. Rothermel, A. Harscher: | |
Dünnschichttechnik für Retinaimplantate. | |
Zeitschrift Mikroproduktion, Ausgabe 1, 2009, S. 10 - 15. | |
A. Kaiser, K. Ruess, S. Hoyler, B. Holl, L. Liu, A. Rothermel, A. Harscher, and E. Feurer: | |
Flexible Thin Film Multi Layer Substrates: Opportunities for Medical Sensors and Actuators. | |
Invited Paper. Proceedings MicroTech 2009: BioSensors and MEMS Packaging, Edinburgh, UK, March 2-3, 2009. | |
2008 | |
A. Kaiser, J. Kusterer, K. Ruess, B .Holl, J. Vanselow, and E. Feurer: | |
Improved Thin Film Substrates: Solid Filled Vias for Enhanced Thermal Properties. | |
3rd European Advanced Technology Workshop on Micropackaging and Thermal Management, LaRochelle, France, January 30-31, 2008. | |
A. Kaiser, J. Kusterer, K. Ruess, B .Holl, J. Vanselow, and E. Feurer: | |
Solid Filled Via: Improved Interconnects for DC and RF Thin Film Applications. | |
IMAPS/ACerS 4th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies CICMT 2008, Holiday Inn - City Centre, Munich, Germany, April 21-24, 2008. | |
D. Kueck, H. El-Hajj, A. Kaiser, E. Kohn: | |
Surface-channel MESFET with boron-doped contact layer. | |
Diamond and Related Materials, Volume 17, Issues 4–5, April–May 2008, pp. 732–735. | |
A. Kaiser, J. Kusterer, K. Ruess, B .Holl, J. Vanselow, and E. Feurer: | |
Improved Thermal Management in High Power Applications by utilizing novel "Filled Via" Thin Film Substrate Technology. General Overview Thin Film Technology at Reinhardt Microtech. | |
IMAPS Metro Chapter Meeting, Long Island, USA, May 8th, 2008. | |
A. Kaiser, K. Ruess, B .Holl, J. Vanselow, and E. Feurer: | |
Current Trends in Thin Film Technology. | |
Deutsche IMAPS-Konferenz 2008, Hochschule München, München, Deutschland, 14. - 15. Oktober 2008. | |
A. Kaiser, K. Ruess, L. Liu, A. Harscher, A. Möller, B. Holl, J. Vanselow, A. Rothermel, and E. Feurer: | |
Technology for Medical Human Implants: Vision Chip on Thin Film Multilayer. | |
Proceedings IMAPS 2008. The 41st International Symposium on Microelectronics, Rhode Island Convention Center, Providence, Rhode Island, USA, November 2-6, 2008. | |
H. El-Hajj, A. Denisenko, A. Kaiser, R.S. Balmer, E. Kohn: | |
Diamond MISFET based on boron delta-doped channel. | |
Diamond and Related Materials, Volume 17, Issues 7-10, July-October 2008, pp. 1259-1263. | |
R. S. Balmer, I. Friel, S. M. Woollard, C. J. H. Wort, G. A. Scarsbrook, S. E. Coe, H. El-Hajj, A. Kaiser, A. Denisenko, E. Kohn, and J. Isberg: | |
Unlocking diamond’s potential as an electronic material. | |
Phil. Trans. R. Soc., vol. 366, pp. 251–265, 2008. | |
A. Munding, H. Hübner, A. Kaiser, S. Penka, P. Benkart and E. Kohn : | |
Cu/Sn Solid–Liquid Interdiffusion Bonding. | |
In: Wafer Level 3-D ICs Process Technology Integrated Circuits and Systems, Springer 2008, pp. 131-169, DOI: 10.1007/978-0-387-76534-1_7 . | |
2007 | |
P. Benkart, A. Munding, A. Kaiser, E. Kohn, A. Heittmann, H. Huebner, U. Ramacher: | |
Three-dimensional integration scheme with a thermal budget below 300°C. | |
Sensors and Actuators A 139 (2007), pp. 350–355. | |
E. Feurer, B. Holl, J. Vanselow, K. Ruess, A. Kaiser: | |
Advanced Thin Film Substrates in Cu-AlN Technology. | |
Proceedings EMPC 2007 European Microelectronics and Packaging Conference, June 17 - 20, 2007, Oulu, Finland, pp. 522-525. | |
A. Kaiser, J. Kusterer, K. Ruess, B .Holl, J. Vanselow, and E. Feurer: | |
Improved Thermal Management in High Power Applications by utilizing novel "Filled Via" Thin Film Substrate Technology. | |
Proceedings IMAPS 2007. The 40th International Symposium on Microelectronics, McEnery Convention Center - San Jose, California, USA, November 11-15, 2007. | |
2006 | |
A. Kaiser, D. Kück, P. Benkart, A. Munding, G.M. Prinz, A. Heittmann, H. Hübner, U. Ramacher, R. Sauer, E. Kohn: | |
Concept for diamond 3-D integrated UV sensor. | |
Joint International Conference on New Diamond Science and Technology & Applied Diamond Conference ICNDST & ADC 2006, Cary, NC, USA, May 15-18, 2006. | |
A. Kaiser, D. Kück, P. Benkart, A. Munding, G.M. Prinz, A. Heittmann, H. Hübner, U. Ramacher, R. Sauer, E. Kohn: | |
3D ChipIntegration Concept - Diamond DUV Sensor on Si. | |
IEEE EDS Workshop on Advanced Electron Devices. Fraunhofer IMS, Duisburg, Germany, June 13-14, 2006. | |
P. Benkart, A. Munding, A. Kaiser, E. Kohn, A. Heittmann, H. Hübner, U.Ramacher: | |
3-Dimensional Integration Scheme With A Thermal Budget Below 300°C. | |
Book of Abstracts APCOT 2006, Asia-Pacific Conference of Transducers and Micro-Nano Technology, Marina Mandarin Hotel, Singapore, June 25-28, 2006. | |
A. Munding, A. Kaiser, P. Benkart, A. Heittmann, H. Hübner, U.Ramacher, E. Kohn: | |
Scaling aspects for microjoints for 3D chip interconnects. | |
ESSDERC 2006, European Solid-State Device Research Conference, Montreux, Switzerland, September 18-22, 2006. | |
A. Kaiser, D. Kück, P. Benkart, A. Munding, G.M. Prinz, A. Heittmann, H. Hübner, R. Sauer, E. Kohn: | |
Concept for diamond 3-D integrated UV sensor. | |
Diamond & Related Materials 15 (2006), pp. 1967-1971; doi:10.1016/j.diamond.2006.07.012. | |
M. Bschorr, H.-J. Pfleiderer, P. Benkart, A. Kaiser, A. Munding, E. Kohn, A. Heittmann, H. Hübner, U. Ramacher: | |
Yield-Improving Test and Routing Circuits for a Novel 3D Interconnect Technology. | |
Advances in Radio Science 4 (2006), pp. 225-229. | |
2005 | |
M. Bschorr, H.-J. Pfleiderer, P. Benkart, A. Kaiser, A. Munding, E. Kohn, A. Heittmann, H. Hübner, U. Ramacher: | |
Eine Test- und Ansteuerschaltung für eine neuartige 3D-Verbindungstechnologie. | |
Advances in Radio Science 3 (2005), S. 305-310. | |
A. Kaiser, A. Munding, P. Benkart, M. Bschorr, A. Heittmann, H. Hübner, U. Ramacher, H.-J. Pfleiderer, and E. Kohn: | |
3-D Integration Technology for Sensor Systems. | |
Workshop on Compound Semiconductor Materials and Devices WOCSEMMAD 2005. Miami, Fl, USA. February 20-23, 2005. | |
A. Kaiser, A. Munding, P. Benkart, M. Bschorr, A. Heittmann, H. Hübner, U. Ramacher, H.-J. Pfleiderer, and E. Kohn: | |
3-D Integration Technology at the University of Ulm. | |
MIT Massachusetts Institute of Technology, Cambridge, MA, USA. February 24, 2005. | |
A. Kaiser, A. Munding, P. Benkart, M. Bschorr, A. Heittmann, H. Huebner, H.-J. Pfleiderer, U. Ramacher, and E. Kohn: | |
3-D Chip Stacking Technology. | |
Eingeladener Vortrag. Rockwell Scientific Company LLC, Thousand Oaks, CA, USA, May 11, 2005. | |
A. Kaiser, A. Munding, P. Benkart, M. Bschorr, A. Heittmann, H. Huebner, H.-J. Pfleiderer, U. Ramacher, and E. Kohn: | |
3-D Chip Integration Technology for Microsystems. | |
207th Meeting of the Electrochemical Society, AC1 - Sensors, Actuators, and Microsystems - General Session, May 15-20, 2005, Quebec City, Canada. Meeting Abstracts - Electrochem. Soc. 501, 1763 (2006). | |
M. Schwitters, M.P. Dixon, A. Tajani, D.J. Twitchen, S.E. Coe, H. El-Hajj, M. Kubovic, M. Neuburger, A. Kaiser, and E. Kohn: | |
Diamond-MESFETs - Synthesis and Integration. | |
2nd EMRS DTC Technical Conference, Edinburgh, UK, June 16-17, 2005. | |
H. El-Hajj, M. Neuburger, A. Kaiser, A. Denisenko, M. Schwitters, D. Twitchen, E. Kohn: | |
P-I-P Diamond MISFET Structure with 150 nm Contact Spacing Opened into a Boron Delta Doped Contact Layer. | |
14th International Workshop on HeterostructureTechnology HETECH 2005, Smolenice, Slovakia, October 2-5, 2005. | |
P. Benkart, A. Munding, A. Kaiser, M. Bschorr, A. Heittmann, H. Hübner, H.-J. Pfleiderer, E. Kohn, and U. Ramacher: | |
3-Dimensional Chip Integration Scheme. | |
Proceedings Micro System Technologies 2005. International Conference & Exhibition on Micro-, Electro-Mechanical, Opto & Nano Systems, München, 5.-6. Oktober 2005, pp. 281-288. | |
M. Schwitters, M.P. Dixon, A. Tajani, D.J. Twitchen, S.E. Coe, H. El-Hajj, M. Kubovic, M. Neuburger, A. Kaiser, and E. Kohn: | |
Diamond-MESFETs - Synthesis and Integration. | |
Proceedings 2nd European Radar Conference EURAD 2005. Paris, France, October 6-7, 2005, pp. 17-20. | |
P. Benkart, A. Kaiser, A. Munding, E. Kohn, A. Heittmann, H. Hübner, U.Ramacher: | |
3D chip stack technology using through chip interconnects. | |
IEEE Journal of Design & Test of Computers 22 (6), Special Issue on 3D Integration. November-December 2005, pp. 512-518. | |
2004 | |
E. Kohn, M. Adamschik, A. Aleksov, A. Denisenko, C. Janischowsky, F.Hernandez-Guillen, A. Kaiser, M. Kasu, M. Kubovic, J. Kusterer, R. Müller, P. Schmid: | |
Diamond Technology for MEMS and Electronics. | |
11th International Conference:"Mixed Design of Integrated Circuits and Systems" MIXDES 2004. Szczecin, Poland. June 24-26, 2004. | |
R. Müller, M. Adamschik, A. Aleksov, A. Denisenko, C. Janischowsky, F. Hernandez-Guillen, A. Kaiser, M. Kubovic, J. Kusterer, P. Schmid, E. Kohn: | |
MEMS technology based on CVD-diamond. | |
MOS-AK/ESSCIRC Workshop 2004, Leuven, Belgium, September 20, 2004. | |
A. Munding, A. Kaiser, P. Benkart, M. Bschorr, A. Heittmann, H. Hübner, H.-J. Pfleiderer, U. Ramacher, E. Kohn: | |
Chip Stacking Technology for 3D-Integration of Sensor Systems. | |
Book of Abstracts. 13th European Workshop on Heterostructure Technology HETECH 2004. Heraklion, Crete, Greece. October 3-6, 2004. | |
2003 | |
A. Kaiser, E. Kohn, H. Seliger: | |
Preparation of DNA-Chips using Diamond-Based Microreaction Technology. | |
27. Internationaler Ausstellungskongreß für Chemische Technik, Umweltschutz und Biotechnologie ACHEMA 2003. Frankfurt/Main. 19.-24. Mai 2003. | |
A. Kaiser, A. Munding, P. Benkart, M. Bschorr, A. Heittmann, H. Hübner, U. Ramacher, H.-J. Pfleiderer, and E. Kohn: | |
Dreidimensionale Integration in Siliziumtechnologie. | |
Gemeinsames Kolloquium des SFB 569 und des Mikroelektronik-Technikums: Mikro-und Nanotechnologie in der Universität Ulm, Ulm, 17. Oktober 2003. | |
2002 | |
A. Kaiser, M. Hinz, M. Adamschik, P. Schmid, R. Mueller, C. Maier, H. Brugger, E.P. Hofer, H. Seliger, E. Kohn: | |
Diamond Based Injection System For Spotting And Synthesis In Biochemistry. | |
Conference Proceedings Sensor Technology. AIChE Annual Meeting 2002, Nov 3-8. Indianapolis, Indiana, USA, pp.175-182. | |
2000 | |
E. Kohn, M. Adamschik, A. Kaiser, R. Müller, P. Schmid, A. Denisenko: | |
Microsystems for biochemical applications based on CVD diamond. | |
Proceedings Conference on Optoelectronic and Microelectronic Materials and Devices, 2000. COMMAD 2000. pp. 259-266. | |